Presented at the MNTeSIG Live! 2022 conference.
Semiconductor Failure Analysis Technician Training
Robert Cormia
Foothill College

Failure analysis (FA) is a critical component of semiconductor manufacturing, spanning inspection and QA/AC defect analysis to wafer and device level problem solving. Materials characterization and analysis tools also support innovation, R&D, and process optimization. A high end FA and materials characterization facility is a significant investment in buildings, tools, and human capital, with analysts often holding masters degrees and/or PhD level education. There’s a strong role for technician level work, a combination of AS degree education, specialized courses in semiconductors, and handson training in characterization tools, from microscopy to surface analysis, to elemental and chemical analysis. Up to 80% of analyses conducted in an FA lab can be readily and competently performed by trained technicians with AS degrees, and specialized training on tools and industry applications.

This presentation will examine the role of technicians in a FA / materials characterization laboratory, using electron microscopy, surface analysis, and elemental and chemical analysis to examine materials for R&D, QA/QC, and failure analysis, including Focused Ion Beam (FIB). Special emphasis is placed on required knowledge in chemistry and physics, device level training, and handson training in microscopy, surface, and elemental and chemical analysis tools. The focus of this presentation is developing effective training programs using multilevel skilled workers to transfer knowledge, skills, and abilities to technicians with less than a bachelor’s degree. Examples from commercial labs are included for context and relevance.
Submitted 7/2/22, 3:00 PM