Many engineers believe the cost of both bare PC boards and assemblies is purely a function board size, thickness, number of layers, spacing between features, etc. Part of that statement is true, but certainly not all of it. There are many things driving cost AND quality of both bare boards and assemblies, things like ‘where’ the copper is located, as opposed to density, parts placements, how the board is routed, balanced PCB stackup, feature sizes, etc.

This onehour session will discuss how to accomplish the goal of both low cost and high quality, with just a few simple concepts. Bottom line, when boards are not designed properly, fab and assembly houses Must make modifications to the boards, just to be able to produce them. Sometimes their mods cause the boards to malfunction. If we design correctly, this will not happen. This workshop is intended for PC board design engineers, electronic engineers and system engineers, as well as technicians and managers interested in Cost and Quality of PC boards.

00:00:00 Introduction
00:03:23 Bare Board Fabrication, Critical Parameters
00:13:50 Fabrication Report Card
00:15:45 Panelization (Panel Sizes)
00:26:19 Fabrication Panel Must Accommodate...
00:35:55 Using an Assembly Panel for Small Boards
00:37:40 Manufacturing a 4 Layer Board (Production Process)
00:51:10 Thief Copper
00:58:36 Coupons
01:03:00 Various Processes (Etching, Multilayer Pressing
01:06:56 Number 1 Rule to Maximize DFM
01:10:28 Things to Know and/or Ask PCB Fab or Assembler
01:14:20 Good Design Rules for Narrow Traces
01:16:10 Good Design Rules for Vias
01:18:49 HDI/Microvia Technology
01:23:40 PCB Assembly, Critical Parameters
01:25:00 Conclusion

Speaker Bio:
Rick Hartley has over 50 years of industry experience focused on circuit and PCB design for computers, aircraft avionics, and telecommunications. After retiring from L3 Avionics Systems where he held the title of Senior Principal Engineer, Rick started his own company RHartley Enterprises, through which he consults and teaches internationally to resolve EMI, noise, and signal integrity issues.

Rick has partnered with major corporations throughout the US and 14 other countries on projects involving medical systems, automotive electronics, and appliances. He's also taught seminars at various IEEE events, PCB West, Freescale Technology Forum, IPC Apex/Expo, AltiumLive, and a number of other public and private forums. Rick is a current member of the IEEE, IPC Designers Council Board of Directors and a past member of the Editorial Review Board for Printed Circuit Design Magazine.

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