This is my tried and true, no fuss method of desoldering DIP (dual inline package) through hole chips.

The CIA chip needs to come out of this Commodore 64C to make way for a DIP socket so I can install other CIA chips for testing.
This method involves using the following tools...
Soldering iron, desoldering pump, solder wick, solder, solder flux, small flat head screw driver, IPA (isopropyl alcohol) and a cleaning rag.

This method works for all kinds of boards and I have used it on Sinclair and Commodore circuit boards with 100% success.

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